Endicott Interconnect: filling the gap: an investigation of blind and thru via fill techniques for semiconductor package and printed circuit board applications.

MY CONVERSATIONS WITH Endicott Interconnect (EI) began in search of details about one of the technologies used in semiconductor packaging products (first level package) and printed circuit board (second level package) applications, via fill. EI offers both conductive and non-conductive versions of via fill, employing a number of diverse techniques that are dependent on the product type, specific design and customer requirement. What I learned in the course of this interview was more than just how and why EI fills some vias. The EI business model, coupled with their vertically integrated technology capability is filling the much bigger gap that exists for engineered interconnect system solutions in the medical, advanced test equipment, defense and aerospace markets. The company is leveraging a strong OEM heritage to provide a comprehensive electronic package to the high reliability market segments.

Everyone knows a bit about IBM history. One of the foremost OEMs in North America, IBM maintained captive printed circuit design, manufacturing and assembly capabilities into the 21st century, long after most of their competitors had outsourced these functions. In November of 2002, IBM decided to spin off printed circuit manufacturing. The newly formed and independently owned entity, Endicott Interconnect, began with minimal fanfare and much trepidation during one of the worst industry slowdowns on record. Four years later, it has diversified its product offering and opened its doors to an extremely receptive merchant market. From 2003 to 2006, the company's sales have grown in excess of 55%. Their market diversification has shifted as well. In 2003 it was 85% IT/Telecom focused. In 2006 it is projected that only 50% of sales will come from IT/Telecom. The significant figure is that 25% of the 2006 sales will come from the defense and aerospace market that was only about 1% of sales three years ago.

In the area of process differentiation, EI builds on the technology development legacy created by IBM. EI manufactures its products using microvias and other enabling technologies. Microvias are incorporated into designs to solve density problems. EI uses different methodologies to generate filled vias in its products. EI can either plate copper metal to fill a via or use a laminating process to fill a via with epoxy. Alternately, EI will screen print filler into the holes with either conductive or non-conductive fill materials. These techniques generate filled vias that provide planarity for layer-to-layer connections. For PCBs (second level packages), filling vias or small through-holes is done primarily to solve manufacturing problems. In the case of first level packages, filling vias with conductive materials like copper can provide improvements in performance including lower inductance, lower electrical resistance and better thermal conductivity.