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Flip chip in standard leaded configuration. (Up Front).

Publication: Electronic Packaging & Production
Date: Sunday, June 1 2003

Advanced Interconnect Technologies Inc. (AIT) has introduced flip chip technology on standard leaded (FCOSL) packages. These high-performance packages reportedly are the first in the industry to use pillar bumping technology from Advanpack Solutions PTE Ltd. They provide better electrical and thermal performance in a smaller footprint than current wire-bond technology. These new packages are ideal for industries such as wireless and automotive, where performance and compactness are critical considerations.

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Flip chip in standard leaded configuration. (Up Front).

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