Small Business Resources, Business Advice and Forms from AllBusiness.com

Dual-Sided Packages

Dual Fine Pitch - No Leads (DFN) and enhanced DFN+ packages combine the performance benefits of array packages with the cost efficiency of leadframe packages. The DFN+ package allows integration of passives on two sides of the leadframe. Both packages eliminate gullwing leads. Their exposed die pad

provides a direct thermal path for heat removal, and their low, 0.75 or 0.90 mm mounted profile reduces wire length for faster electrical performance. The packages' lead finish and high-contrast black background improve lead alignment for SMT placement equipment's optical pattern-recognition systems (PRS). Advanced Interconnect Technologies Inc. , Pleasanton, Calif.

In addition, make sure to read these articles: