- ESI Introduces Model ICP5530 Dual-Head Laser System
for IC Packaging Applications.
Business Editors/High-Tech Writers 2004 Japan Printed Circuit Association (JPCA) Show PORTLAND, Ore.--(BUSINESS WIRE)--May 26, 2004 New UV Laser Microvia System Targets Advanced-Chipset Packages for High-End ......
- Leading Semiconductor Packaging Manufacturer Chooses
Veeco Optical Profilers; Veeco...
WOODBURY, N.Y. -- Veeco Instruments Inc. (Nasdaq: VECO) today announced that a leading semiconductor packaging manufacturer has chosen its Wyko(R) SP3250(TM) Optical Profiler to ......
- Wafer-Level event to track IC
packaging.
The first annual International Wafer-Level Packaging Congress (IWLPC) to explore semiconductor packaging and test technologies, with special emphasis on three-dimensional (3-D) stacked packaging, will be ......
- Plate-Circuit Molding System
PCM-100 is a completely different type of auto-molding system, developed exclusively to encapsulate one-sided packages with fine-pitch wires. Operating by means of four cavity plate ......
- Coater/Developer
Clean Track Lithius coater/developer is made for high-volume sub-100 nm production, and has a throughput capability of 150 wph. It has one- and two-block configurations, ......
- Coater/Developer
Clean Track Lithius coater/developer is for high-volume sub-100 nm production, and has throughput capability of 150 wph. It has one- and two-block configurations, and allows ......
- Electrohydraulic dual power-shift
control.
MOST agricultural tractors (under 100 horsepower) built for the European market incorporate a synchronized transmission that reduces gear shift effort and increases durability. This type ......
- Technical progress: BDF-Boscato & Dalla Fontana
has unveiled new advances in its forming...
The company BDF, which has for many years been committed to meeting the demands for innovation from container glass manufacturers, has announced new developments in ......
- Mako PCI bus chipset to be uncaged by Toshiba at Comdex.
SAN JOSE, Calif.--(BUSINESS WIRE)--Nov. 7, 1994--Toshiba America Electronic Components Inc. (TAEC) Monday announced that it will introduce the Mako PCI chipset, a R4x00 series compatible ......
- Texas Micro Modular, High-End CompactPCI System Bringsa New Level of Performance and...
HOUSTON--(BUSINESS WIRE)--July 1, 1998--Texas Micro Inc., a leading manufacturer of industrial and telecommunications microcomputers and systems, announces its family of high-end CompactPCI(R) systems. The CP80 ......
- Texas Micro Modular, High-End CompactPCI System Bringsa New Level of Performance and...
HOUSTON--(BUSINESS WIRE)--July 1, 1998--Texas Micro Inc., a leading manufacturer of industrial and telecommunications microcomputers and systems, announces its family of high-end CompactPCI(R) systems. The CP80 ......
- New Dual RF PLL Frequency Synthesizer from FujitsuMicroelectronics Offers Design...
SAN JOSE, Calif.--(BUSINESS WIRE)--May 18, 1999-- Fujitsu Microelectronics, Inc. (FMI) today introduced its new MB15U36 Dual RF PLL Frequency Synthesizer, joining the recently released "SL" ......
- Tetra Prisma
Tetra Prisma ......
- VPNs in the distributed enterprise: security begins
with the firewall. (Network...
Although larger companies may be able to address the need for security in a disributed network by linking their various locations with leased lines, this ......
- UB Networks Announces Enterprise Fast Ethernet Products; A Single Source For Desktop,...
SANTA CLARA, Calif.--(BUSINESS WIRE)--Jan. 8, 1996--UB Networks today announced an enterprise-wide Fast Ethernet solution representing the broadest end-to-end Fast Ethernet product line in the networking ......