SPIL Selects Lithography Systems From SUSS MicroTec To Support Its Solder Bumping Services.

MUNICH, Germany -- SUSS MicroTec (FWB:SMH)(GER:SMH), the leading manufacturer of lithography equipment for the wafer level packaging and solder bumping market announced it has recently received orders for lithography systems and coat/bake/develop tracks from Siliconware Precision Industries (SPIL),

one of the world's largest packaging foundries located in Taiwan. The purchase orders, signed in January and April this year, represent additional follow-on business from this key customer and include two MA200e full field lithography systems, and multiple production coating clusters for processing 200 and 300mm wafers, in support of SPIL's ongoing solder bumping capacity expansion. The deal signifies SUSS MicroTec's well established presence as supplier of wafer processing equipment for the wafer level packaging market.

"SUSS MicroTec systems provide us with the capabilities needed to supply the latest design in solder bumping processes, especially in WLCSP and RDL, to the industry, which is driven by improved chip performance, package form factor and lower cost", comments Johnson Tai, Vice President, Manufacturing 3rd Division at SPIL. "SUSS spin coaters and mask aligners did not only show superior production performance but also maintained and exceeded the respective key performance criteria for this type of bumping application."

Solder wafer bumping is a mainstream solution to advanced packaging requirements that offers many options to the manufacturers of miniaturized integrated devices and provides a robust and functional interconnect solution that preserves high performance operation. Solder bumps typically have a pitch down to 150 micro m and require resist thicknesses between 50 and more than 100 microns. Forming wafer bumps via lithography can be accomplished by using either a photolithography stepper or a proximity mask aligner depending on the performance vs. cost equation parameters particular to individual manufacturers. The main advantage of SUSS proximity aligners compared to steppers is the full-field mask process, which enables control of the full wafer-layout, higher throughput and lower cost of ownership in general.

"Having supplied lithography systems to Taiwanese customers for many years now we are very pleased to receive this order from SPIL", comments Rolf Wolf, Managing Director of SUSS MicroTec's Lithography Division. " SUSS mask aligners and spin coating systems are enjoying strong sales worldwide and the new order proves again SUSS leadership in Wafer Level Packaging equipment in Taiwan. Both aligners and coaters offer superior performance and reliability for all major thick resist applications."

About SPIL

Located in Taichung, Taiwan, Silicon Precision Industries Ltd (SPIL) offers three IC packaging plants and one testing plant, with a total floor space exceeding 935,000 sq. feet. Siliconware is a broad based comprehensive A/T company capable of addressing all IC packaging and testing requirements. Our strong financials and global logistics network mean that we can supply services and support to design houses and fabless foundries globally. Siliconware is ideally located to address Taiwan's growing IC Foundry business with 40 wafer fabs located on the island now. Our business strategy is clear, we aim to become your preferred partner - and we will continue to focus 100% on backend services - wafer sort, assembly, final test, burn-in and drop ship. Our global vision is to become a world leader in subcontract assembly, test and design services.

About SUSS MicroTec

SUSS MicroTec is a leading supplier of production, process and test technology for the semiconductor industry. SUSS maintains its leadership position with over 7,000 systems installed worldwide. SUSS products include coating developing systems, 1X full-field lithography (1XFFL) systems, substrate bonders, flip-chip bonders and probe systems. Headquartered in Munich, Germany, SUSS has 5 international manufacturing sites and provides support from sales and service centers in North America, Europe, Asia and Japan. For more information, please visit http://www.suss.com

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