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IPC, HKPCA to co-create International Exhibition in China. (Asia Watch).(Brief Article)

IPC and Hong Kong Printed Circuit Association (HKPCA) have announced plans to co-produce the International Printed Circuit and Electronics Assembly Fair on September 1719, 2003, at the Guangzhou International Convention Center in Guangzhou, China. The inaugural event will serve both the PCB and electronics assembly industries.

"We are very excited about this joint venture, which will undoubtedly leverage the experience, memberships and synergies of our two associations," says Stan Pizak, IPC chairman of the board and SMTC Corporation executive VP.

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