Developing electroplated wafer bumping technology. (Up Front).(Brief Article)

A Advanced Semiconductor Engineering Inc. (ASE) one of the world's largest semiconductor packaging and testing companies, announced that its team of R&D engineers has successfully completed its internal development of electroplated wafer bumping technology on 200mm wafers and has begun a pilot run at its Kaohsiung manufacturing facility.

Wafer bumping has gained popularity due to the advent of the flip chip packaging technology that enables high performance for high density semiconductor chips Electroplated wafer bumping offers many advantages for high pip count and fi