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Thermal integrity: a must low-power-IC digital design: this year's Design Automation...

By Santarini, Michael
Publication: EDN Asia
Date: Thursday, December 1 2005

Over the last three years, IC-power management has moved from a third-order to a first-order concern for chip designers, especially those designing ASICs and SOCs (systems on chips) for portable-system applications. Accordingly, many power tools made their debut at this year's Design Automation Conference, which took place in Anaheim, CA, in June. Experts say that, to get a true grasp of transistor leakage--an ever-larger consumer of system power--you must first get a read on the thermal effects of your design and how they impact the timing and reliability of digital ICs. Experts

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