SANTA CLARA, Calif.--(BUSINESS WIRE)--March 17, 1995--Integrated Device Technology Inc. (IDT) reported today that recent heavy rains and local flooding throughout the Bay Area and Central Valley caused no damage to its semiconductor manufacturing fabs, including its facilities in Salinas and San Jose, Calif.

The Salinas fab is located above the valley floor in the Airport Industrial Park and has been unaffected by the recent rains. Constructed in 1984, the Salinas sub-micron wafer fab is currently being converted from five-inch to six-inch wafer production.

The benefit of moving to six-inch wafers is a 50% increase in silicon area produced. The facility includes a 95,000 square-foot building with a 25,000 square-foot clean room area, employs more than 600 people and is the location of IDT's Static RAM and Specialty Memory product lines.

In addition to the fab in Salinas, IDT has manufacturing facilities in San Jose and assembly and test facilities in Penang, Malaysia. Construction on the new eight-inch wafer manufacturing plant in Hillsboro, Ore. and on the plant expansion project in Penang continues on schedule.

About IDT

Integrated Device Technology Inc. (IDT) designs, manufactures, and markets CMOS VLSI integrated circuits (ICs) for a wide range of growth markets, including desktop computer, workstation/server, data communications, and office automation. IDT offers products in four key areas: high-speed SRAMs, RISC microprocessors, specialty memories and high-performance logic. The company's product areas are synergistic and provide solutions that optimize the cost and performance of microprocessor-based systems. Headquartered in Santa Clara, IDT employs approximately 2,850 people worldwide.

CONTACT: Integrated Device Technology Inc., Santa Clara

Larry Jordan, 408/492-8385

Tami Maggio, 408/492-8699