SUSS MicroTec Wins Multimillion-Dollar Follow-On Orders for Multiple 300 mm Wafer Bumping...

MUNICH, Germany -- Orders expand market leadership in 300 mm lithography equipment for wafer level bumping

SUSS MicroTec AG (FWB:SMH), a leading manufacturer of production and test equipment for the microelectronics and nano device markets, has recently received orders for multiple 300mm

lithography systems from Taiwan based Advanced Semiconductor Engineering (ASE), one of the world's largest semiconductor packaging and testing companies. The multimillion-dollar orders represent significant follow-on business from this key customer. The orders include several MA300Plus Full Field Lithography systems and several ACS300Plus Coat/Develop wafer-processing Clusters, which ASE will use for expanding its 300 mm solder bump capacity and advancing its solder bump technology. The shipments include key elements of SUSS' established SupraYield technology. Installations are scheduled to begin in July.

Wafer-level solder bumping is a burgeoning requirement to manufacture advanced semiconductor products that include microprocessors and high-performance graphic devices. According to market research firm Prismark Partners, the demand for bumped wafers will grow approximately 4-fold within the next five years.

"The benefits of using advanced packaging technologies such as wafer bumping, passive integration, redistribution and pad opening become even more pronounced for 300mm wafers. ASE has worked hard to take the leadership position for technology and production in 300mm packaging. We are happy to have a supplier like SUSS on our team," said J.J. Lee, vice president, ASE Group Research and Development. "SUSS' equipment has proven instrumental for successfully offering our bumping services in a highly competitive market environment."

"We enjoy seeing the accomplishments of our customers and in turn we are rewarded with a leading market share in advanced packaging - a testament to the fact that SUSS is truly dedicated to their satisfaction and long term success," said Dr. Franz Richter, president and CEO of SUSS MicroTec. "Our 300mm success in Taiwan and now recently in Japan offers strong evidence that our technology exceeds the ever advancing performance and cost requirements of the marketplace."

About SUSS MicroTec

SUSS MicroTec is a leading supplier of production, process and test technology for the semiconductor industry. SUSS maintains its leadership position with over 7,000 systems installed worldwide. SUSS products include coating developing systems, 1X full-field lithography (1XFFL) systems, substrate bonders, flip-chip bonders and probe systems. Headquartered in Munich, Germany, SUSS has approximately 720 employees worldwide and provides support from sales and service centers in North America, Europe, Asia and Japan. SUSS MicroTec AG is listed in the Prime Standard segment of the German Stock Exchange.

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