SUSS MicroTec Receives Multiple Orders for 300mm Wafer Bumping Equipment from SPIL; SupraYield...

MUNICH, Germany -- SUSS MicroTec AG (FWB:SMH), a leading supplier of packaging lithography and test equipment for the microelectronics and nano device markets, has recently received orders for lithography systems and coat/bake/develop tracks at Taiwan based Siliconware Precision Industries (SPIL).

SPIL is one of the world's largest semiconductor packaging and testing companies. This new business represents additional follow-on 300mm business from this key customer. The order includes SUSS' MA300Plus 1X Full-Field Lithography systems (1XFFL) and ACS300Plus wafer-processing cluster, in support of 300mm production ramping at SPIL's advanced wafer bumping facility in Taiwan. The shipments include key elements of SUSS' recently introduced SupraYield technology. Installations will begin in Q2 2004.

According to Mr. Johnson Tai, SPIL VP Bumping Manufacturing 3rd Division, "We are dedicated to delivering turn key solutions for the full spectrum of our customer's IC packaging needs. SUSS helps us achieve our goal with a complete lithography solution. Their coater and developer technology is leading edge in advanced packaging and their 1X Full-Field Lithography with SupraYield delivers a lower cost of ownership. As an integral partner, SUSS strengthens our ability to meet our customers' wafer level packaging and bumping process demands."

Dr. Dirk Rothweiler, SUSS Managing Director Asia Operations, said: "We are extremely pleased that SPIL has selected SUSS as a key supplier for their expanding wafer bumping business after rigorous head to head evaluations. We believe SUSS' lithography package will provide SPIL with the technological and cost advantages necessary to compete successfully in this growing market."

Wafer-level bumping is a burgeoning requirement to manufacture advanced semiconductor products that include microprocessors and high-performance graphic devices. According to market research firm Prismark Partners, the demand for bumped wafers will grow approximately 4-fold within the next five years.

For more information relating to SUSS MicroTec and SUSS technology visit www.suss.com.

About SUSS MicroTec

SUSS MicroTec is a leading supplier of production, process and test technology for the semiconductor industry. SUSS maintains its leadership position with over 7,000 systems installed worldwide. SUSS products include coating developing systems, 1X full-field lithography (1XFFL) systems, substrate bonders, flip-chip bonders and probe systems. Headquartered in Munich, Germany, SUSS has 5 international manufacturing sites and provides support from sales and service centers in North America, Europe, Asia and Japan. SUSS MicroTec AG is listed in the Prime Standard segment of the German Stock Exchange. For more information, please visit www.suss.com

About SPIL

Located in Taichung, Taiwan, Silicon Precision Industries Ltd (SPIL) offers three IC packaging plants and one testing plant, with a total floor space exceeding 935,000 sq. feet. Siliconware is a broad based comprehensive A/T company capable of addressing all IC packaging and testing requirements. Our strong financials and global logistics network mean that we can supply services and support to design houses and fabless foundries globally. Siliconware is ideally located to address Taiwan's growing IC Foundry business with 40 wafer fabs located on the island now, including UMC and TSMC. Our business strategy is clear, we aim to become your preferred partner - and we will continue to focus 100% on backend services - wafer sort, assembly, final test, burn-in and drop ship. Our global vision is to become a world leader in subcontract assembly, test and design services.

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