SANTA CLARA, Calif. -- ChipX, the Structured ASIC leader, today announced that Louis DiNardo, President and Chief Operating Officer of Intersil Corporation, has been appointed to the company's board of directors, effective immediately.

"With his very deep business and technology background in the mixed signal and analog IC market, Lou DiNardo is a welcome addition to the board of directors," said ChipX CEO, Amnon Fisher. "ChipX has reached an important milestone, having released PCI Express and USB 2.0 platforms combining a Structured ASIC fabric with mixed signal building blocks. We now need to expand our product line by incorporating other analog and mixed signal building elements. With his knowledge of market and customer requirements, Mr. DiNardo will advise us on our choices and recommend best practices to address the challenges ahead of ChipX. He will also consult management on marketing, sales, operations, and planning."

Lou DiNardo has been involved in sales, marketing and operations in the semiconductor industry for approximately 25 years. Currently, Mr. DiNardo is President and COO of Intersil. He is responsible for all the product divisions, worldwide sales, corporate marketing, and operations planning. From July 2004 to January 2005, Mr. DiNardo was Executive VP and GM of Intersil's Power Management Products Group. He joined Intersil following the acquisition of Xicor, where he served as Co-Chairman, President and CEO since November 2000. Mr. DiNardo came to Xicor from Linear Technology Corporation, where his last position was GM of Mixed Signal Products. Prior to Linear, Mr. DiNardo began his career at Analog Devices.

"ChipX recognizes that system OEMs have a unique opportunity to solve complex chip design issues with platforms that combine analog and Structured ASIC fabric on a single piece of silicon," said Louis DiNardo. "I'm excited to join the ChipX board and help guide the company to the next level of success."

About ChipX

ChipX, Inc. is a pioneer and leading manufacturer of late-stage programmable application-specific integrated circuits, or Structured ASICs. The company's innovative, patented technology consolidates wafer production tooling, reduces time-to-market and minimizes the total cost to profit. ChipX Structured ASIC technology is widely used in consumer equipment, computing peripherals, communication systems, industrial control, medical equipment, instrumentation and military/aerospace systems. For more information about ChipX families of Structured ASICs, please visit www.chipx.com. Headquartered in Santa Clara, CA, ChipX is a privately held corporation, founded in the U.S. in 1989. A subsidiary, ChipX (Israel) Ltd., performs Research & Development. Investors include Elron Electronic Industries, Ltd. (NASDAQ:ELRN), VantagePoint Venture Partners, Wasserstein Venture Capital, Newlight Associates, Parker Price Venture Capital, UMC, Needham Capital Partners and Insite Capital.

(C) 2006 ChipX Inc. All other products or service names mentioned herein are the property of their respective owners.