- Hynix develops 24-chip MCP
In a new development that has the potential to allow for consumer electronics of an unprecedented size, memory chip maker Hynix Semiconductor http://www.hynix.com has reportedly developed a 1.4-millimeter thick multi-chip package (MCP) with 24 stacked NAND flash memory chips. According to reports from Korean newspaper Korea Times http://www.koreatimes.co.kr/www/news/biz/2007/09/123_9628.html , Hynix's ......
- Chartered, Tezzaron team for high-speed 3D memory chips
Foundry player Chartered Semiconductor Manufacturing http://www.charteredsemi.com announced Tuesday that it is beginning to ramp production of ultra high-speed memory chips for memory architecture prototype developer Tezzaron Semiconductor http://www.tezzaron.com . Chartered is manufacturing Tezzaron's 3T-iRAM family of two-dimensional 72-Mbit memory devices. According to the companies, these parts use proprietary technology that mimics ......
- Flash memory chip demand to
explode.
Roaring demand for flash memory chips, popular in hot-selling music players and digital cameras, will accelerate later this year; but industry leader Samsung will hold prices down, according to Reuters. Samsung Electronics Co. Ltd., Seoul, Korea, which controls nearly 60 percent of the NAND flash market, is cutting prices in ......
- Samsung Commences 90nm 512Mbit DDR SDRAM Production
Yesterday marked another first for the semiconductor industry, this time the beginning of mass production in Seoul, South Korea, for 512Mbit DDR SDRAM chips on 300mm wafers using a 90nm process. This achievement was accomplished by Samsung Electronics Co. Ltd., which began its foray into 90nm production last year when ......
- Samsung Strong in Q3
Samsung Electronics Co. Ltd. posted Q3 net income of $2.29 billion (2.19 trillion won) on revenue of $15.9 billion ( 15.22 trillion won). Revenues were 8 percent higher than the company's Q2 results and 5 percent higher than Q3 2005, while the net income was 45 percent higher than Q2 ......
- Samsung Claims Industry's First System-in-Package with NAND Flash, SDRAM
Samsung Electronics Co. today claimed to introduce the industry's first system-in-package (SiP) with an ARM-based processor, NAND flash and SDRAM for next-generation mobile phone and handheld applications. Samsung said the SiP integrates logic and memory technology into a single package, reducing component count and shrinking form factors in handheld devices ......
- Samsung to develop memory chips and
OLED.
Worldwide Computer Products News-26 August 2005-Samsung to develop memory chips and OLED(C)1995-2005 M2 COMMUNICATIONS LTD http://www.m2.com Samsung Electronics Co Ltd, an Asian technology company, has announced that it is developing new RAM memory chips and thinner liquid crystal display (LCD) screens. Samsung is planning the development of magnetic RAM chips, ......