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Ship at Your Risk Part IV: Small Biz Tips to Safer Shipping From FedEx, UPS... Whether you’re going with FedEx, UPS or DHL, these private shipping companies have their own sets of rules ... (BLOG POST) Neil MacRaild. Ovation Products named Neil MacRaild president, responsible for expanding sales channels, broadening the company's reach and bringing products ... (PERIODICAL ARTICLE) Production system design for qualityrobustness. 1. Introduction 1.1. Motivation Production system design has an impact on product quality. However, little research has been ... (PERIODICAL ARTICLE) Scope Looking Ahead To the Electronics Packaging Technology Conference Nobody should be in the dark at this point about ... (PERIODICAL ARTICLE) Mobile and Wireless Packaging Solutions Mobile consumer electronics markets continue to be among the largest and fastest growing semiconductor segments. Mobile phone handsets ... (PERIODICAL ARTICLE) Events. EVENTS JUNE 5/29-6/1 Electronic Components and Technology Conference (ECTC) Reno, NV Contact: ectc.net 5/30-6/1 JPCA Show 2007 Tokyo ... (PERIODICAL ARTICLE) New high-performance nylons for automotive, electronics, packaging. * Nylon producer Ems-Grivory America in Sumter, S.C., is reaching beyond its traditional product range to bring out ... (PERIODICAL ARTICLE) Binghamton a Hub for Electronics 'Packaging' BING HAMTON - Though no local companies manufacture silicon chips, Binghamton is at the center of the computer ... (PERIODICAL ARTICLE) Events. DECEMBER 6-8 Implementing Lean Manufacturing and Beyond Mobile, AL Contact: www.lean.org/Events/ 7-9 International Semiconductor Device Research Symposium Bethesda, ... (PERIODICAL ARTICLE) Events. JANUARY 17-19 Pan Pacific Microelectronics Symposium & Tabletop Exhibition Big Island of Hawaii Contact: www.smta.org 18-20 InterNepcon World ... (PERIODICAL ARTICLE) Coatings for electronics is subject of spring Virtual Learning Conference. The FSCT has announced the latest offering in its 2006 schedule of Virtual Learning Conferences. On April 6, ... (PERIODICAL ARTICLE) 'Coatings for Electronics' virtual conference to be offered by FSCT in... An upcoming FSCT Virtual Learning Conference (VLC) will focus on the cutting-edge topic of conformal chemistry. "Introduction to ... (PERIODICAL ARTICLE) BladeCenter packaging, power, and cooling HEADNOTE This paper addresses the packaging, power, and cooling of the IBM eServer(TM) BladeCenter compact server infrastructure consisting ... (PERIODICAL ARTICLE) Active Boundary Layer Thinning in Advanced Packaging Electroplating Electrochemical deposition is expanding rapidly as a method to form a variety of metal structures in advanced packaging, ... (PERIODICAL ARTICLE) The evolution of build-up package technology and its design challenges HEADNOTE This paper reviews sequential build-up (SBU) laminate substrate development from its beginning in 1988. It reports on ... (PERIODICAL ARTICLE) Japan's PCB industry: Japan's board makers continue to grow--and invest... In 2004, Japanese PCB production reached $10.3 billion, about 90% of its past peak. Japanese overseas production of ... (PERIODICAL ARTICLE) X-ray inspection—Not all black or white Advanced automated optical inspection (AOI) can catch solder-paste defects as well as calculate area and volume, but it's ... (PERIODICAL ARTICLE) Low-cost wafer bumping HEADNOTE As the demand for flip-chip interconnects mounts across an increasingly large spectrum of products and technologies, several ... (PERIODICAL ARTICLE) Transitioning to Pb-free assemblies: convergence on a single lead-free... Five years ago the international microelectronics industry was considering and testing several lead-free alloys that could potentially replace ... (PERIODICAL ARTICLE) Defense electronics boosts advanced packaging: recent events have helped... The Government Electronics and Information Technology Association (GEIA, Arlington, VA) estimates that the electronics content of the 2002 ... (PERIODICAL ARTICLE)
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International Microelectronic and Packaging Society
Electronics engineers and specialists in industry, business, and education. Encourages the exchange of information across boundaries of fields of specialization; supports close interactions between the complementary technologies of ceramics, thick ...

Members: 9,000
Founded: 1967
Dues: individual, $75 annual; corporate, $600 annual; associate corporate, $250 annual; affiliate corporate, $100 annual; student, retired, $5 annual.

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IEEE Components, Packaging, and Manufacturing Technology Society