Business Periodicals

Electronic Packaging & Production: 20030601

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1. Success amid the ruins. (On the Line).(Editorial) While much of today's electronics manufacturing landscape resembles a scarred battlefield, some solid success stories really exist and are waiting to be told. Although each ... (PREMIUM PERIODICAL ARTICLE) 2. UIC commits to China with new facility. (Asia Watch).(Brief Article) Universal Instruments Corp. continues its commitment to China with the opening of a US$5million manufacturing facility in Shekou, Guangdong Province. The new manufacturing facility will ... (PREMIUM PERIODICAL ARTICLE) 3. IPC, HKPCA to co-create International Exhibition in China. (Asia Watch). IPC and Hong Kong Printed Circuit Association (HKPCA) have announced plans to co-produce the International Printed Circuit and Electronics Assembly Fair on September 1719, 2003, ... (PREMIUM PERIODICAL ARTICLE) 4. Tessera introduces Pyxis packaging. (Up Front). Signaling a new era in semiconductor packaging for cellular phones and wireless electronic products, Tessera Inc. unveiled the Pyxis platform, reportedly the world's first chip ... (PREMIUM PERIODICAL ARTICLE) 5. Stacked die CSPs see double digit growth. (Up Front). Driven by growth in mobile phones, shipments of stacked packages are expected to grow at a dramatic rate of more than 50 percent in 2003, ... (PREMIUM PERIODICAL ARTICLE) 6. March 2003 PCB book-to-bill Ratio. (Up Front).(Brief Article) IPC announced the findings from its monthly Interconnect Manufacturing Services (IMS)/Printed Circuit Board (PCB) statistical program. The U.S. IMS/PCB Industry book-to-bill Ratio for March 2003 ... (PREMIUM PERIODICAL ARTICLE) 7. Report analyzes medical electronics connector market. (Up Front).(Brief... Bishop and Associates has released a new six-chapter research report analyzing the medical electronics market for connectors. It provides a comprehensive analysis of the world ... (PREMIUM PERIODICAL ARTICLE) 8. Flip chip in standard leaded configuration. (Up Front). Advanced Interconnect Technologies Inc. (AIT) has introduced flip chip technology on standard leaded (FCOSL) packages. These high-performance packages reportedly are the first in the industry ... (PREMIUM PERIODICAL ARTICLE) 9. Developing electroplated wafer bumping technology. (Up Front).(Brief... A Advanced Semiconductor Engineering Inc. (ASE) one of the world's largest semiconductor packaging and testing companies, announced that its team of R&D engineers has successfully ... (PREMIUM PERIODICAL ARTICLE) 10. New book on Chip Scale Packaging. (Up Front). A new book titled Chip Scale Packaging for Modern Electronics is now available from Electrochemical Publications Limited. It was written by Joseph Fjelstad, Reza Chaffarian ... (PREMIUM PERIODICAL ARTICLE)
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