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Circuits Assembly

Issue Date: 11/01/2007

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In This Issue

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1. Small packages, big markets: mobile phones are driving explosive WLP growth. Wafer-level package (WLP) shipments have exceeded expectations, both in number of units shipped and device size. Once relegated to the few I/O range, WLPs ... (PERIODICAL ARTICLE) 2. Diagnosing high-volume medical processes: novel printing tools and methods... There's no debating that the medical market is huge. According to Prismark Partners, spending on non-IT medical electronics was $53 billion in 2006, with ... (PERIODICAL ARTICLE) 3. Value for money? Methods for dispassionately narrowing your supplier list. What is value for money? Tricky question. It can mean so many different things to different people, and is often irrational, and the circumstances ... (PERIODICAL ARTICLE) 4. Pb-free manufacturing from a tier III EMS perspective: how one company made... EMS firms have been involved in the Pb-free transition for a considerable time. In fact, one might say the process has reached a level ... (PERIODICAL ARTICLE) 5. 'Living documents, subject to change': the origins--and... Today, every step in electronics manufacturing--from the components to the board to the physical and electrical connections themselves--is governed by standards. Standards regulate the ... (PERIODICAL ARTICLE) 6. Creating ideal solder joints: effects of stencils and thermal profile are... Stencil quality and the major elements comprising it play a pivotal role in ensuring solder paste is properly deposited on a PCB's surface mount ... (PERIODICAL ARTICLE) 7. An alternative drying process for MSDs: components baked at 70[degrees]C... Ed.: The complete article is at circuitsassembly.com. J-STD-033B places a costly baking burden on the assembler. To mitigate this, it permits "alternative drying processes" ... (PERIODICAL ARTICLE) 8. 'Customer satisfaction is more than a score': DEK explains the... DEK has been honored with Service Excellence Awards five years running. CIRCUITS ASSEMBLY asked Americas general manager Neil MacRaild to what DEK attributed its ... (PERIODICAL ARTICLE) 9. Optoelectronic substrates: will they happen? Acceptance will require... Ed.: This article can be viewed in its entirety at circuitsassembly.com/cms/content/view/5611. Optoelectronic interconnect is an alternative to copper that can provide increased bandwidth and ... (PERIODICAL ARTICLE) 10. A modern proposal. I hate editorializing about trade shows. I feel like I'm robbing the readers, most of whom are far more interested in what was on ... (PERIODICAL ARTICLE)
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