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Polishing Pads

The FAST CS7 polishing pads are for CMP, and feature discrete, separate, closed-cell pores that present slurry uniformity on the pad surface. FAST S7 open-cell pads have pores distributed continuously throughout the pad matrix for rapid and efficient distribution of slurry across

and through the pad surface. Both pad series are based on the company's thermoset polyurethane resins that provide polish uniformity, planarization efficiency, high throughput, long pad life and low-defect wafer finishing. PPG Industries Inc. , Pittsburgh, www.ppg.com .

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